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September 12, 2005

Vendor Claims New Type Of Memory To Make Devices Smaller



Courtesy of Mobile Pipeline

A joint venture between chipmakers AMD and Fujitsu claimed Monday that it has sampling a new type of Flash memory that will enable vendors to create smaller mobile devices.

Spansion LLC said it has started sending samples of its Package-on-Package (PoP) Flash memory to device vendors. In a statement, the group said that it's approach combines system memory with the logic chipset, which decreases size and provides enhanced memory performance on mobile devices.

"As wireless devices become more and more sophisticated, they require Flash memory solutions that offer increased code and data storage in a package that doesn't increase the form factor of the end product," Amir Mashkoori, executive vice president of Spansion's Wireless Solutions Division," said in a statement.

The company said the system is available now for wireless phones but provided no specifics about pricing.

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